"המצב הזה לא יכול להימשך - אני מעריך שמחירי הדיור יירדו ב-20%"

In a move to increase company profitability, Kulicke & Soffa Industries (Nasdaq:KLIC) is relocating manufacturing of manual wire bonders from Haifa to its Yokneam, Israel facility.

The move will combine its manual wire bonder operations with its bonding tools (MicroSwiss brand) business unit, already located in Yokneam, the company said. No definite date has been planned yet for the relocation.

K&S says it has experienced tremendous growth for manual wire bonders in recent years, reaching a 50% worldwide market share.

The company says it foresees continual growth as it expands into key market areas including microwave, opto-electronics, defense and low chip on board applications.

K&S says it will be committing more R&D funding and continue product development for all manual bonders.

To better focus on this core packaging assembly technology, the company is also considering the potential sale or closure of its blade and dicing equipment business unit, also located in Haifa.

Kulicke & Soffa makes semiconductor assembly and test interconnect equipment, materials and technology.